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  HOME > Products >Industrial Grade miniSD > Industrial Grade miniSD
Industrial Grade miniSD
Using carefully screened SLC flash components, ATP Industrial Grade miniSD is built using SIP (System In Package) technology, allowing for industry leading waterproof, extreme temperature durability.
 
 
 
  For specification/testing reports, please click here.

Maximum Performance in Any Environment

Ruggedized flash products designed to perform consistently under conditions of extreme temperature, shock, vibration, and humidity.

Introducing ATP Industrial Grade miniSD Cards, optimized for demanding industrial applications such as military, automotive, marine navigation, aviation, where mission-critical data requires the highest level of reliability, durability, and data integrity.

ATP's SIP (System-In-Packaging) manufacturing process encapsulates all exposed components and points of failure to ensure the products are fully waterproof, shockproof, and ESD (Electro-Static Discharge) proof. ATP Industrial Grade SD Cards can withstand an operating temperature range of at least -40 to 85 degrees Celsius.

In addition to this temperature range, the cards are completely waterproof, dustproof, and ESD (Electro-Static Discharge) proof. All ATP Industrial Grade SD cards are produced under a stringent RoHs and Green Package compliant manufacturing process to guarantee a consistent high level of build quality and performance.

 

The ATP Industrial Grade Flash cards have been previously tested and qualified by major handheld companies such as Intermec, Motorola, Janam, LXE, Honeywell and Datalogic for Point of Sales, bar coding, data collection, radio frequency identification (RFID), and enterprise mobility applications.

Outstanding Performance

ATP Industrial miniSD cards deliver outstanding performance with read speed (seq) up to 18MB/sec and write speed (seq) up to 16MB/sec

Highly Reliable
     
All ATP Industrial Grade CF, SD, USB drives, and SSDs are constructed using best-in-class SLC (Single-Level Cell) components with enhanced Error Correction Code (ECC) functions and wear leveling algorithms. This results in MTBF ratings over 2 million hours and the highest write cycle lifetimes in the industry.

ATP's SIP (System-In-Packaging) manufacturing process encapsulates all exposed components and points of failure to ensure the products are fully waterproof, shockproof, and ESD (Electro-Static Discharge) proof.

Full Manufacturer Support and Product Consistency

Being a true manufacturer gives ATP the ability to support customers with a fixed BOM policy, ensuring both consistent compatibility and performance.  ATP also fully supports its customers with product  customization and tuning to optimize performance in particular or specialized applications.

 

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